PROTECT & INSULATE
Potting & encapsulation compounds
Epoxy systems for protecting electronic components and assemblies.
Made for your application.
The potting range includes clear, flexible, high-temperature, flame-retarded and lightweight systems. Your component geometry, pour volume and thermal conditions help determine the appropriate material.
What to consider
- Potting volume and heat generation during cure
- Flow into fine spaces and around components
- Operating environment and mechanical requirements
Explore the range
Fast-setting epoxy adhesive
An easy-spreading adhesive for general bonding across a range of materials.
Low-viscosity clear epoxy resin system
An optically clear epoxy system with low viscosity to help it flow into small spaces.
Low-viscosity clear epoxy resin system
A clear epoxy system in the Resintech range of potting and encapsulation materials.
Low-viscosity epoxy resin system
A low-viscosity potting system with low exotherm characteristics.
High-temperature epoxy resin system
An epoxy potting system for applications requiring high-temperature performance.
Highly flexible epoxy resin system
An unfilled flexible epoxy system with good flow characteristics for potting and encapsulation.
Fast-setting flexible epoxy resin system
A fast-curing thixotropic epoxy with adhesion to flexible substrates.
Flame-retarded epoxy resin system
A flame-retarded epoxy system for protective potting applications.
Medium-viscosity epoxy resin system
A medium-viscosity epoxy potting system with physical and mechanical properties for encapsulation.
Lightweight epoxy resin system
A low-density epoxy resin system for applications where weight is a key design consideration.
Product selection depends on your application. Review the relevant technical and safety documents and confirm suitability with the Resintech team.