BOND & SEAL
Epoxy adhesives & sealants
Two-part epoxy systems for bonding, sealing and specialist assembly.
Made for your application.
Select from general-purpose, structural, flexible, optically clear and electrically conductive systems. Match the adhesive to your substrates, application method and curing process.
What to consider
- Materials and surface preparation
- Bond-line thickness and flexibility
- Working time and cure conditions
Explore the range
Fast-setting epoxy adhesive
An easy-spreading adhesive for general bonding across a range of materials.
Fast-curing structural epoxy adhesive
A structural adhesive for bonding difficult surfaces, with a fast room-temperature cure.
Fast-setting epoxy sealant
A non-sag epoxy sealant for applications where the material needs to stay in position.
Flexible high-performance epoxy adhesive
A flexible epoxy adhesive for demanding bonds, including cable harnessing applications.
Thixotropic thermally resistant epoxy adhesive
A thixotropic version of the RT154 system for applications needing controlled placement.
Optically clear fast-curing epoxy adhesive
A fast-curing clear epoxy for bonding and potting optical components where clarity matters.
Electrically conductive epoxy adhesive
A conductive epoxy developed for shield and connector termination in EMC applications.
Product selection depends on your application. Review the relevant technical and safety documents and confirm suitability with the Resintech team.